MSK32W-M16
Overview
The MSK32W series modules are ultra-low power, high performance Arm® Cortex®-M4 based wireless microcontrollers supporting Zigbee 3.0, Thread and Bluetooth Low Energy 5.0. The module core chip can be following,
- K32W061/41 – BLE/ZigBee/NFC tag
- QN9090/30 – BLE/NFC tag
- JN5188/89 – ZigBee/NFC tag
In order to meet various application and using scenario, there are three module models available:
- MSK32W-M10 – Middle Power Module with PCB antenna
- MSK32W-M13 – Middle Power Module with u-FL connector
- MSK32W-M16 – High Power Module with Antenna Diversity
Customers can select chip and module type combinations depending on coverage, antenna type and function requirements. Hence, this range of modules allows designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost.
Block Diagram
Benefits
- Very low current solution for long battery life
- Single chip device to run stack and application
- Flexible sensor interfacing
- Optional Embedded NTAG
- Lead-free and RoHS compliant
Junction temperature range: 40 C to +125 C
Applications
- Zigbee 3.0, Thread networks
- Bluetooth Low Energy 5.0 networks
- Robust and secure low-power wireless applications
- Smart lighting, door locks, thermostats and home automation
- Wireless sensor networks
Features: Radio
- 4 GHz IEEE 802.15.4 2011 compliant
- 4 GHz Bluetooth Low Energy 5.0 compliant
- Receiver current 4.3 mA
- IEEE 802.15.4 Receiver sensitivity -100 dBm
- Bluetooth Low Energy 5.0 2 Mb/s high data rate
- Bluetooth Low Energy Receiver sensitivity -97 dBm
- Improved co-existence with WiFi
- Configurable transmit power up to +10 dBm, with 46 dB range
- Transmit power / current +9.5 dBm / 20.3 mA
- Transmit power / current +2.5 dBm / 9.4 mA
- Transmit power / current 0 dBm / 7.4 mA
- 9 V to 3.6 V supply voltage
- Antenna Diversity control
- u-FL connector or PCB antenna
Features: Microcontroller
- Integrated ultra Low-power sleep oscillator
- Deep Power-down current 350 nA (with wake-up on IO)
- 128-bit, 192-bit or 256-bit AES security processor
- MAC accelerator with packet formatting, CRCs, address check, auto-acks, timers
- Application CPU, Arm Cortex-M4 CPU
- On-Chip memory: 640 KB flash; 152 KB SRAM
- 12 MHz to 48 MHz system clock speed for low-power
- 2 x I2C-bus interface, operate as either master or slave
- 10 x PWM
- 2 x Low-power timers
- 2 x USART, one with flow control
- 2 x SPI-bus, master or slave
- 1 x PDM digital audio interface
- 19-channel DMA engine
- Up to four GPIOs can be selected as pin interrupts
- 32-bit Real Time clock (RTC) with 1 s resolution.
Introduction
The MSK32W-Myy module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the NXP K32W061 series of chips they are ultra-low power, high performance Arm® Cortex®-M4 based wireless microcontrollers supporting ZigBee 3.0, Thread and Bluetooth Low Energy5.0 networking stacks to facilitate home and building automation, smart lighting, smart locks and sensor network applications.
The modules integrate all of the RF components required, removing the need to perform expensive RF design and test.Products can be designed by simply connecting sensors and switches to the module IO pins. Hence, this range of modules allowsdesigners to bring wireless applications to market in the minimum time with significantly reduced development effort and cost.
Due to NXP K32W series chips provide following different options
- K32W series – both support ZigBee and BLE with NFC option
- JN5189 series – Support ZigBee only with NFC option
- QN9090 series – Support BLE only with NFC option
Module can be following different options
- M10 – Support middle power with PCB antenna
- M13 – Support middle power with u-FL connector
- M16 – Support high power both PCB and u-FL connector diversity
The Bluetooth and ZigBee can’t transmit at the same time, M16 only supports the ZigBee function. All modules have
FCC , CE and Industry Canada modular approvals. The variants available are described below.
Variants
MSxxxx(T)-Myy
Table1 Module Variants
For further information about chip specification, please refer to the following links.
K32W061/41 : https://www.nxp.com/docs/en/data-sheet/K32W061.pdf
QN9090/80 : https://www.nxp.com/docs/en/nxp/data-sheets/QN9090(T)QN9030(T).pdf
JN5189/88: https://www.nxp.com/docs/en/nxp/data-sheets/JN5189.pdf
**Please note, MS90xx series module doesn’t support the high power module model.
Regulatory Approvals
The MSK32WT-M10/M13/M16 have been tested against the requirements of the following European standards
Table2 Regulatory approvals of modules
The module with u-FL connector can connect with an antenna with up to (T.B.D) dBi, 10mW/Mhz power spectral
density e.i.r.p is the maximum permitted in Europe. pin to pin compatible
Table3 FCC ID and ISED ID numbers
Electrical Characteristics
Recommended operating conditions
Table4 Recommended operating conditions
Radio Transceiver
> RF port characteristics
Table5 RF port characteristics
> IEEE 802.15.4 radio transceiver characteristics: +25⁰C
VDD = 1.9 V to 3.6 V ; unless otherwise specified.
Table6 IEEE 802.15.4 radio transceiver characteristics
[1] Considering an integrated BW of 2 MHz, and a minimum SNR of 4 dB for the demodulator
> Bluetooth Low Energy radio transceiver characteristics: +25⁰C
VDD = 1.9 V to 3.6 V; unless otherwise specified.
Table7 BLE radio transceiver characteristics
[1] Considering an integrated BW of 1 MHz, and a minimum SNR of 9 dB for the demodulator.
[2] Interference rejection 1 Mb/s is the difference between the power of the wanted Bluetooth
Low Energy 1 Mb/s at -67 dBm and the power of the modulated interferer Bluetooth Low
Energy 1 Mb/s, for 0.1% BER.
Pin configuration
Outline Drawing
Pin configuration
Outline Drawing
Tray information
All models are packed in one size Tray, the Tray dimension is below.
The standard packing is based on 500 pcs, using 11 trays which include cover.
All modules will be packed in a vacuum packing bag which include trays, humidity indicator card, desiccant.
Net weight and Gross weight
Table8 Module pin description
Related Documents
NXP Chip Datasheet
K32W061/41 : https://www.nxp.com/docs/en/data-sheet/K32W061.pdf
QN9090/80 : https://www.nxp.com/docs/en/nxp/data-sheets/QN9090(T)QN9030(T).pdf
JN5189/88: https://www.nxp.com/docs/en/nxp/data-sheets/JN5189.pdf
Label Marking
